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Test-station for flexible semi-automatic wafer-level silicon photonics testing
As the need for data links with ever greater bandwidth continues to grow, optical interconnects are becoming an attractive alternative to electrical links. The cost and performance of optical transceivers are key elements that determine the economic viability of optical interconnects. This paper presents developing an active silicon photonics platform that leverages existing CMOS infrastructure and processing techniques to provide a wide range of passive and active optical devices on silicon wafers.
Automated Testing of Bare Die-to-Die Stacks
This paper presents an approach to perform automatic stepping and probing on arrays of D2D stacks pick-n-placed (PnP) on a carrier substrate. An algorithm will be described for the Cascade Microtech CM300 probe station to automatically correct small PnP misalignments. Experimental results will be presented on three types of carriers: (1) dicing tape on tape frames for Ø 100 mm wafers, (2) sheets of single-sided thermal-release tape, and (3) Ø 300 mm carrier wafers with double-sided thermal-release tape.
3 Key Challenges for Consistent, Accurate RF Measurement Results
Engineers deal with architectures and multi-functional ICs that continuously decrease physical dimensions, while operation frequencies and levels of integration complexity increase. Learn how they achieve high levels of accuracy and confidence in measurement results.
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Tomorrow’s Chip Interconnects Call for New Reliability Test Method
Shrinking semiconductor geometries with reduced reliability margins demand a highly accurate method for modeling EM effects to produce proper IC design rules. CVEM offers a precise solution to avoid these pitfalls and enable IC manufacturers to continue offering aggressive performance specifications without sacrificing quality.
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FormFactor Completes Acquisition of Cascade Microtech
By completing the acquisition of Cascade Microtech, FormFactor transforms into a broader test and measurement market leader with significant scale and increased diversification.
Introducing EPS200MMW- achieve accurate measurement results at 67 GHz up to THz frequencies
At higher frequencies, probe placement with submicron accuracy on calibration substrates and DUTs is critical for accurate and repeatable measurement results. The EPS200MMW manual 200 mm probe solution addresses this need with its rigid case-base frame, solid platen with four-point support and highly-refined granite base plate, and includes a fine-glide chuck stage to offer both wide-range coarse movement and submicron-level fine movement.
Learn More: 200 mm Probe Systems
Flexible 300 mm Probing Platform
Cascade Microtech’s CM300xi is a flexible on-wafer measurement platform that scales to meet evolving needs in capability and automation. It enhances device and process characterization and modeling by capturing the true electrical performance of devices and enabling hands-off productivity. With the new Velox™ probe station control software, the CM300xi enables safe and fast wafer loading and easy test automation and measurement system integration, while preventing damage of probe tips, probe cards and customer wafers throughout the entire measurement cycle. Read more ...
New Velox Probe Station Control Software
Velox harnesses the flexibility of Nucleus and the power of ProberBench, and enables the fastest time-to-job completion for mixed environment labs. Velox gives you several options to simplify the setup and execution of automated sequences on your probe stations. Upgrade to Velox today and achieve gains in both speed and productivity.
Learn more: Velox - Probe Station Control Software