Tomorrow’s chip interconnects call for a new reliability test method

Article Reprint - EE Evaluation Egnineering - Timothy McMullen - Undaunted by the skyrocketing costs of new semiconductor fabs and the formidable hurdles facing the industry with each new technology node, leading IC manufacturers are continuing to strive for shrinking geometries.

Created: August 23, 2017 | Updated: August 23, 2017 | Type: pdf | Size: 621.06 KB

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