COMPASS 2017 Keynote and Featured Speakers Announced

Our fifth users’ conference is being held October 18th – 20th in Half Moon Bay, CA, and our keynote and featured speakers are now in place.
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Overcoming Challenges with Probing High Pad Count ICs

Probing high pad count integrated circuits (ICs) in order to verify functionality has always been a challenge. See how one company tackled these challenges.
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Come See Us at the 29th International Symposium

Join us at the Royton Sapporo, Sapporo, Japan May 28–June 1, 2017 for the 29th International Symposium on Power Semiconductor Devices and ICs (ISPSD).
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Transforming 300 mm Probing with Contact Intelligence Technology

We have integrated a number of our proprietary technologies to produce Contact Intelligence, which enable automation and compress cycle times to an absolute minimum.
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Which Probe Tip Calibration is Best for Active Device Characterization?

We evaluated three probe tip calibration methods for active device characterization to determine which was best. Read our blog to see what we found.
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3 Key Advantages of Wafer-Level Reliability versus Package-Level Reliability Testing

WLR offers three key advantages to a reliability test program compared to PLR. To explore these benefits in detail, download our technical brief.
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