The Cascade Microtech PA300PS 3D is the first probe station for electrical probing of 3D stacked structures on wafer level. Many different engineering and monitoring tests after wafer production as well as before the next stacking steps or final packaging can be addressed with this flexible tool.

The PA300PS 3D incorporates MicroAlign™, Automated Thermal Management (ATM™), ReAlign™ and ProbeShield® technologies. This allows tests in a wide temperature range, collecting low signal data in an EMI-shielded environment using high pin count vertical probe cards and furthermore enabling damage free probing of small test pads to avoid influences of the pad probe marks to further bonding steps. The improved z-theta chuck stage assembly provides micrometer resolution in combination with increased thermal and mechanical stability for highest accuracy, lowest drift and maximum stiffness at high probe forces by the unique z-axis wedge design. The thermal chuck system provides the highest planarity and fastest temperature transmission time on the market for maximum test effectiveness and perfect system planarity in combination with the adjustable probe card leveling. The unique ContactView™ camera and iVista™ microscope provide optimum visualization of all ongoing tasks in all 3 dimensions for maximum operations safety and effectively.