Failure Analysis/Design Debug
Multi purpose analysis of the smallest features - on-wafer or in package
Viewing and making electrical contact to sub-micron internal IC circuit features can be challenging. Mechanical stability and precision, flexible and easy application changeover coupled with precision electrical measurement capability, make Cascade systems the right choice for failure analysis.
| Measurement/Technology | Application Need | Solution |
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IC or memory design debug | Internal node test with IC powered up, IC timing analysis, signal verification, localized deprocessing, FIB pad probing | Ultra Stable Probe System, laser cutter, high impedance probes, CAD navigation, vibration isolation, probe card holder |
Sub-micron probing | High impedance probing, viewing and probing <0.25 µm features, DC testing, localized deprocessing, FIB pad probing | Rigid/stable system, high impedance probe, laser, CAD navigation, vibration isolation |
Emission microscopy | IR spectrum, thermal analysis, thinned wafer support, backside probing, interface to CAD navigation software | Ultra Stable Probe System, CAD navigation, vibration isolation |
Internal node probing | High impedance probing, passivation removal, metal cutting, low load and high bandwidth measurements, catch one time and spurious events, localized deprocessing, FIB pad probing | Rigid/stable system, high impedance probe, laser, CAD navigation, vibration isolation |
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Package test | Discrete component/PCB testing | Rigid/stable Probe System, Stage PCB clamp |
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| Related Files |
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| eVue Product Brochure |
