QFP35 Test and Burn In Socket

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The QFP35 test and burn in sockets are the superior alternative to higher-priced, long lead-time RF test sockets. For a fraction of the cost associated with ATE sockets, these low-cost, high-performance, compression-mount test sockets deliver superior signal integrity for peripherally leaded devices with integrated paddle-grounding systems.

QFP/SO Test & Burn In Socket
Features	QFP35
Available down to 0.35mm pitch Rated for 10k insertions MIN Solderless compression mount Cover options for thermal management Small pcb footprints for near device component placement	QFP35 Datasheet