LGA Test and Burn In Socket

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LGA50 test sockets ensure successful LGA packaged device testing. LGA50 specifically addresses the demanding high-perfor­mance signal integrity requirements for high-frequency component and system-level testing. These high-performance, standardized compression-mount test sockets accommodate a wide range of standard and custom package sizes and I/O counts.

LGA50 Test and Burn In Test Sockets
Features	LGA50
For LGA and area array QFN package styles Contact pitches from 1.00mm down to 0.50mm Low insertion loss up to 10GHz Current rating of 4A per contact Solderless compression mount Rated for 15k insertions Cover options for thermal management	LGA Datasheet