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ITC2015 - Automated Testing Bare D2D Stacks

This paper presents an approach to perform automatic stepping and probing on arrays of D2D stacks pick-n-placed (PnP) on a carrier substrate. An algorithm will be described for the Cascade Microtech CM300 probe station to automatically correct small PnP misalignments. Experimental results will be presented on three types of carriers: (1) dicing tape on tape frames for Ø 100 mm wafers, (2) sheets of single-sided thermal-release tape, and (3) Ø 300 mm carrier wafers with double-sided thermal-release tape.

ITC2015 - Automated Testing Bare D2D Stacks

Created: August 23, 2017 | Updated: August 23, 2017 | Type: pdf | Size: 2.89 MB

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