We are honored to be named a Technology Association of Oregon’s finalist for Enterprise Technology Company of the Year! Each year, the association awards companies in categories consisting of St…
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If you’re a probe customer, or thinking of becoming one, we want to make sure that you are not only completely satisfied with your on-wafer probe, but that you’re positioned to maximize yo…
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Until recently, power device manufacturers have been saddled with the task of sending power devices out for packaging prior to characterization and model extraction. This extra step adds cost, plus de…
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Emerging energy standards and increasing power consumption demand additional performance capabilities. These trends are clearly seen in industries such as aircraft, spacecraft, electrical power, commu…
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We’ll be in booth 401B in Agilent Avenue at the European Microwave Week conference in Manchester, England October 11th through the 13th. Here are some of the workshops and sessions we’ll b…
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As device dimensions decrease and the operation frequencies are pushed toward the THz range it is becoming essential to improve conventional wafer-level mm-wave device characterization methods. Accura…
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When moving from 2-port measurements to 4-port device measurements, the first thing you might ask is, “Can my 2-port methods be directly applied to 4-port?” The answer is clearly: NO. Seve…
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System calibration is critical to getting accurate measurement data from RF wafer devices. During calibration, a set of known standards must be presented to the tip of the probe. This requires multipl…
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