Wafer Probing on Fine-Pitch Micro-Bumps for 2.5D and 3D-SICs

Wafer probing on fine-pitch micro-bumps for 2.5D- and 3D-SICs requires advanced probe technology. See some recent research with IMEC.
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Keysight Technologies Joins our MeasureOne™ Best-of-Breed Solutions Program

Our MeasureOne best-of-breed IC test and measure solution welcomes a new partner Keysight Technologies. Check out our blog for details.
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Six Challenges with Small Pad Probing

Here are six challenges with small pad probing, all of which are solvable with the InfinityQuad multi-contact probe.
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Come See Us at ITC – The International Test Conference – October 21-23!

Come see us at ITC, where we will present a paper with IMEC, and host a poster session on Advanced Parametric Probe Challenges.
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9 Steps to Determining Online Cleaning Parameters for Pyramid Probes

Here are 9 steps to help you determine cleaning parameters for Pyramid Probes, including cleaning interval, touchdowns per clean and cleaning overtravel.
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Copper Pillar Contact Resistance Study Summary

A study that compares the two different types of solder balls and the tin-capped CU pillars and then compared the differences in the contact resistance.
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Cascade Microtech in the News

Cascade Microtech was recently featured in The Oregonian newspaper, highlighting our recent growth and our position for future success.
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CONNECT – Join Us at a City Near You

We will be presenting our latest on-wafer probing solutions that address your measurement and test challenges at a CONNECT city soon.
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