Five Challenges with Achieving Accurate, Wafer-Level Flicker Noise Measurements

Posted on January 31, 2013 by Cascade Microtech Posted in Flicker Noise
Five challenges with accurately measuring wafer-level flicker noise and what led us to develop the Edge measurement solutions. Read our blog to learn more.
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Probe Card Technology Requirements for Tackling Known Good Die (KGD)

Posted on January 23, 2013 by Cascade Microtech Posted in Probe Cards
The importance of external semiconductor tests when tackling KGD cannot be understated, and may be of greater value than a BIST alternative. Read our blog to learn more.
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CM300 – A New Flexible, Scalable On-wafer Probe System

Posted on January 18, 2013 by Cascade Microtech Posted in Probe Systems
Our newest on-wafer probe system is modular, flexible and reliable for accurate testing on small pads down to 30 μm. Read our blog for more great features and benefits.
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ISO 9001: 2008 Certification Lays Foundation for Process Maturity Level 5 Goal

Posted on January 4, 2013 by Cascade Microtech Posted in Events
We recently validated our semiconductor test quality management system with the receipt of our ISO 9001:2008 certification. Read our blog to learn more about this great honor.
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SELECTShip™ – Taking the Headaches out of Your Equipment Shipping Needs

Posted on December 14, 2012 by Cascade Microtech Posted in Probes
SELECTShip is a new semiconductor testing equipment delivery and shipping service from Cascade Microtech, designed to streamline your logistics. Read our blog for more on this new program.
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Pyramid Probe Cards – The Importance of Transmission Line Models

Posted on November 29, 2012 by Cascade Microtech Posted in Probe Cards
When using our Pyramid Probe Cards, transmission line modeling information is useful for impedance matching the device under test (DUT) to a particular load, or to predict the insertion loss of the overall assembly. Read our blog to learn more.
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Cascade Microtech… On the Road Again

Posted on November 20, 2012 by Cascade Microtech Posted in Events
Cascade Microtech will be attending and exhibiting a several APAC events at the end of November. Read our blog to see where we will be.
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4 Wafer Probe to Pad Alignment (PTPA) Errors that Impact Test Productivity

Posted on November 16, 2012 by Cascade Microtech Posted in Probes
An overview of four wafer probe to pad alignment (PTPA) errors that impact semiconductor test productivity.
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