Five Challenges with Achieving Accurate, Wafer-Level Flicker Noise Measurements

Five challenges with accurately measuring wafer-level flicker noise and what led us to develop the Edge measurement solutions. Read our blog to learn more.
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Probe Card Technology Requirements for Tackling Known Good Die (KGD)

The importance of external semiconductor tests when tackling KGD cannot be understated, and may be of greater value than a BIST alternative. Read our blog to learn more.
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CM300 – A New Flexible, Scalable On-wafer Probe System

Our newest on-wafer probe system is modular, flexible and reliable for accurate testing on small pads down to 30 μm. Read our blog for more great features and benefits.
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ISO 9001: 2008 Certification Lays Foundation for Process Maturity Level 5 Goal

We recently validated our semiconductor test quality management system with the receipt of our ISO 9001:2008 certification. Read our blog to learn more about this great honor.
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SELECTShip™ – Taking the Headaches out of Your Equipment Shipping Needs

SELECTShip is a new semiconductor testing equipment delivery and shipping service from Cascade Microtech, designed to streamline your logistics. Read our blog for more on this new program.
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Pyramid Probe Cards – The Importance of Transmission Line Models

When using our Pyramid Probe Cards, transmission line modeling information is useful for impedance matching the device under test (DUT) to a particular load, or to predict the insertion loss of the overall assembly. Read our blog to learn more.
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Cascade Microtech… On the Road Again

Cascade Microtech will be attending and exhibiting a several APAC events at the end of November. Read our blog to see where we will be.
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4 Wafer Probe to Pad Alignment (PTPA) Errors that Impact Test Productivity

An overview of four wafer probe to pad alignment (PTPA) errors that impact semiconductor test productivity.
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