CONNECT Around the World to Address Emerging Test and Measurement Challenges

Cascade Microtech announces CONNECT, a series of local events to discuss semiconductor test challenges and solutions, including process characterization/modeling and high-power device probing.
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On the Road in May: PCIM and ISPSD in Europe and Asia

Join us in May at two great power device conferences. One in Germany and the other in Japan. Read our latest blog to learn more.
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Join Us in April: International Wireless Symposium and International Reliability Physics Symposium

Cascade Microtech will be at two IEEE shows in April; the International Wireless Symposium and the International Reliability Physics Symposium. Read our blog post for details.
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We’re a Finalist for Enterprise Technology Company of the Year

We are honored to be named a Technology Association of Oregons finalist for Enterprise Technology Company of the Year. Read our latest blog post for more.
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New Qualcomm Integrated RF Multichip May Benefit from Known Good Die (KGD)

Qualcomms new integrated RF multichip module with integrated power amp switches and duplexers is a great example of device that might benefit from Known Good Die (KGD). Read our blog post to learn more.
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High-Power Chuck Design Challenges

High-power, in combination with thin wafers, can create chuck design challenges. Read our latest blog to explore these challenges and learn about our TESLA probe stations that take these into consideration.
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InfinityQuad RF Probe: For Today’s Complex, Advanced Integrated Circuits

Todays advanced, complex integrated circuits require high-performance RF probes. Read our latest blog that shows why InfinityQuad meets todays challenges.
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Small Pad Probing – The Challenge with Conventional Probes

Small pad probing poses many challenges for conventional probes. Read our latest blog post that discusses these challenges and shares a solution.
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