Our Infinity Probe® sets a standard of performance by ensuring better measurements on aluminum pads, reducing reprobing and errors in measured data. We believe it’s a key component of an integrated wafer level test solution that includes the probing station and its control system, measurement software, along with turnkey installation and even training.
The Infinity Probe expands device characterization capabilities through these features:
- Typical contact resistance of < 50 mΩ over 100,000 cycles on aluminum pads
- Typical contact resistance variation of < 10 mΩ during a 5-hour single contact test on aluminum pads
- Ability to test devices with shrinking pad geometries (30 μm x 30 μm)
- Reduced damage to aluminum pads
- Superior RF measurement accuracy
- Improved Ground – Signal RF performance
- Accuracy to 500 GHz
In addition, the overall wafer level test solution expands device characterization performance and productivity through:
- MicroChamber® enclosures for low-current and low-temperature measurement. Available on 200 mm and 300 mm probe stations, this capability eliminates the need for re-configuration of the test system between RF and parametric tests on the same wafer, thus improving test engineer and test equipment asset productivity. It also reduces the possibility of damage to expensive 1mm coaxial cables and millimeter-wave modules. In addition, system integrity is ensured and there will be no need for continual re-qualification of the system.
- Thermal test range capability (-65°C to 300°C) permits modeling of mm-wave devices over-temperature ensuring a more accurate and comprehensive device model. 125ºC maximum for Infinity Probes; use our ACP Probes (+200ºC maximum) or |Z| Probes® (+300ºC maximum) if higher temperatures are required.
- Thermally isolated auxiliary chuck: The calibration substrate is located on this chuck. The thermal isolation from the main chuck ensures the accuracy and integrity of the calibration is maintained during over temperature test. The load impedance on the substrate remains 50 Ω in spite of changes to the main chuck temperature.
- Impedance Standard Substrates (ISS): verified at millimeter-wave frequencies.
- WinCal XE™ Calibration Software: Our patented, advanced calibration technique has been demonstrated to be the most accurate method for calibration to 500 GHz.
These advantages set a standard in increased measurement accuracy and repeatability. In addition, they significantly increase the productivity of device characterization engineers while at the same time greatly improving the return on the substantial investment RF semiconductor companies must make in wafer-based test systems. This approach also ensures automation and correlation of data between different measurements and measurement systems, subsequently reducing modeling, design cycle time and time-to-market.
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